The Effect of Initial Surface Profile on the Surface Roughness and Roundness in Ball Burnishing Process

Abdallah, Abdalrahman Mohamed; Aly, Mohamed Abdelsalam; Ibrahim, Abdelkader Abdelkarim; Hassan, Hala Abd El- Hakim; Mohammed, Waleed

doi:10.21608/jesaun.2025.370426.1461

The Effect of Initial Surface Profile on the Surface Roughness and Roundness in Ball Burnishing Process

Document Type : Research Paper

Authors

¹ Department of Design and Production Engineering, Faculty of Engineering, Ain Shams University, Cairo, Egypt

² Department of Mechanical Engineering, Faculty of Engineering, Shoubra, Benha University

³ Department of Design and Production Engineering, Faculty of Engineering, Ain Shams University, Cairo, Egypt.

⁴ Department of Mechanical Engineering, Faculty of Engineering, Sinai University, Egypt

10.21608/jesaun.2025.370426.1461

Abstract

Most of investigations in burnishing field are considered the effect of burnishing process conditions on the produced surface characteristics. This work investigates the effect of surface characteristics obtained from the previous turning machining process (initial surface profile ) on the resulted burnished surface characteristics of AISI 1025 . Specimens with different surface characteristics have been prepared using a turning process with different feed rates and depths of cut. The burnishing process was applied to these specimens with a constant burnishing condition. The surface characteristics considered in this study were surface roughness (Ra) and out of roundness. These surface characteristics were measured after both turning and burnishing. Surface roughness and out of roundness were greatly improved by burnishing process. The percentage of improvement in surface roughness ranged from 67% to 91%, while the reduction in out of roundness reached 75%. Initial surface profile resulted from the previous process has a considerable effect on the surface characteristics produced by burnishing process.

Keywords

Main Subjects

Mechanical, Power, Production, Design and Mechatronics Engineering.

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